Drew Turner, IBM, has organized an excellent tutorial program. The following lists the invited tutorial speakers and topics:

·         Tutorial #1: Subhasish Mitra, Stanford University, “Circuit Failure Prediction for Robust System Design in Scaled CMOS,”

·         Tutorial #2: Tibor Grasser, Technical University of Vienna, "The Negative Bias Temperature Instability (NBTI),"

·         Tutorial #3: Alvin Strong, IBM, " JEDEC Overview,"

·         Tutorial #4: Chadwin Young, SEMATECH, " Measurement Issues for High-k Technology including NBTI,"

·         Tutorial #5: William Tonti, " eFuse Design and Reliability,"

·         Tutorial #6: Wilfried Haensch, IBM, "Reliability of 'Future' Devices."


Tutorial speakers are approachable and available throughout the workshop, one of the benefits of the friendly, intimate setting.


 


Who: Subhasish Mitra
Title: Circuit Failure Prediction for Robust System Design in Scaled CMOS
Tentative duration: TDB

Circuit failure prediction predicts the occurrence of a circuit failure "before" errors actually appear in system data and states. This is in contrast to classical error detection where a failure is detected after errors appear in system data and states.  Circuit failure prediction is performed concurrently during system operation or during periodic on-line self-test by analyzing the data collected by special circuits called "sensors" inserted at strategic locations inside a chip. This talk demonstrates the concept of circuit failure prediction, practical implementation of the concept, and its effectiveness in overcoming major scaled-CMOS reliability challenges such as early-life failures (also called infant mortality) and aging. The concept of circuit failure prediction also provides insignts into early-life failure behaviors that may be used in developing new techniques for screening early-life failure candidates during production test.



 

Who: Alvin Strong
Title: JEDEC Overview
Tentative duration: 45min
JEDEC is the leading developer of standards for the solid-state industry.  However for some, there may be a mist about JEDEC that clouds the what JEDEC really is and really does.  The intent of this tutorial is to clarify everyone’s understanding of the mission of JEDEC, to show the breadth of JEDEC, and to give the opportunities of service.  The focus will be on JEDEC 14.2 since this is the JEDEC committee that is responsible for Wafer Level Reliability.  Furthermore that focus will be on our most recent standards and those currently on our agenda including the update to the Foundry Guidelines.  


 

Who: Chadwin Young
Title: Measurement Issues for High-k Technology including NBTI
Tentative duration: 1hr 30min
This tutorial will be comprised of several parts that address various measurement methodologies required for properly characterizing high-k gate stacks.  While discussing these techniques, emphasis will be placed on proper instrumentation and set up, followed by proper data analysis and interpretation.  Some of the key methodologies that will be discussed are:  Capacitance – Voltage (C-V), Pulsed Current – Voltage (I-V), and reliability evaluation techniques. The intended outcome of this tutorial is for the attendees to leave with a better understanding of high-k characterization requirements that he/she can implement in everyday measurements and have increased insight about these novel gate stacks.



 

Who: William R. Tonti
Title: eFuse Design and Reliability
Tentative duration: 1hr 30min
Programmable eFuse designs present an integration challenge in modern CMOS processing.  The power level to program a fuse, and the programming methodologies leverage reliability mechanisms which all other elements in a design avoid.  A high degree of eFuse process control and circuit design is required in order to guarantee operation.  Almost all eFuse types are one time programmable and are limited to “one chance” programmable.  This paper will discuss selected eFuse technologies describing the design philosophy, electrical programming and characterization, the physics of failure, and some of the many applications an on chip programmable element provides.