JEDEC

JEDEC will be held at Stanford Sierra Conference Center from
1 pm October 20 through 11 am October 21, 2005

(immediately following IRW)

   14.2 JEDEC Subcommittees include Dielectric, Device and Interconnect

Please contact Al Strong, astrong@us.ibm.com, for more details.

Dielectric Reliability Working Group Agenda

  1. Discussion of new changes and modifications to new test procedure for characterizing process/plasma induced damage.
    Action Items to be discussed:
    • -Paragraph about PID effects on different technologies and circuit architectures.
    • -Paragraph on sampling plan.
    • -Idealize data plots for figures.
    • -Report PID efforts in individual companies.
  2. Review JP001 Foundry Qualification guidelines on PID and GOI Tests.
  3. Discuss new business and future work.

Interconnect Task Group Agenda

  1. Review Draft Revision of JEP 139: "Constant Temperature Aging to Characterize Copper Interconnect Metallization for Stress-Induced Voiding"
    JEP 139 - Standard Guide for Isothermal Aging Method to Characterize Aluminum Interconnect Metallizations for Stress-Induced Voiding was written by Timothy Sullivan. He has used this standard as a starting point from which to prepare a test method for copper interconnects Plans are to submit the draft to a Committee Ballot after discussions at this meeting. A new test standard for aluminum interconnects is still needed.

    Timothy Sullivan


  2. Review Draft Revision of JESD 61: Isothermal Electromigration Test. (To make it applicable to copper interconnects.)
    A major revision in JESD 61(prepared by Maurizio Impronta) has been made to make the standard applicable to copper interconnects. Draft includes recent revisions in JEP119A (SWEAT) and JESD33B (TCR). Original standard was written by Raif Hijab.

    Maurizio Impronta & Raif Hijab


  3. Discuss development of new JEDEC standard for a three-parameter lognormal distribution for electromigration failures in copper interconnects.

    Baozhen Li


  4. On the Matter of Updating JP-001
    JP-001 JEDEC/FSA Joint Publication - Foundry Process Qualification Guidelines (Wafer Fabrication Manufacturing Sites)

    Raif Hijab


  5. Revision of JESD 87 to Make It Applicable to Copper
    JESD87- Standard Test Structures for Reliability Assessment of AlCu Metallizations with Barrier

    Harry Schafft


  6. To Discuss developing BEOL TDDB Jedec Document
    Requesting Volunteers .................................

    All

    H.S.Ratore/T. Sullivan/H. Schafft/8-19-05